STM UV tape products are used for wafer thinning, dicing and polishing. STM tapes reduce to near zero tack after UV light exposure, facilitating easy device removal without damaging sensitive devices. Our sister company, GDSI, www.wafergrind.com, provides complex wafer thinning and dicing services, sharing with customers hands on technical information on the use of UV tape.

STM products are first qualified at STM's $8 million research fab in San Jose, California. In addition to dicing tape, STM supplies backgrinding tape, uv irradiators for curing dicing tape, and semiconductor tape mounters.