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 Semiconductor Tapes and Materials’ first-hand experience using wafer tape in backend wafer assembly is a key differentiator from other semiconductor tape suppliers. STM is housed under the same roof as GDSI, Grinding and Dicing Services Inc., www.wafergrind.com, an ISO 9001:2000 certified facility. Our privately owned, 3,000 sq. foot, Class 100 cleanroom and Class 10,000 modular unit, assists with customer evaluations. Direct access to our engineering support allows for STM’s technical staff to discuss any aspect of your semiconductor tape selection project.
Semiconductor Tapes and Materials’ research facility in the Silicon Valley, California supports all aspects of UV tape evaluation.
Qualification testing equipment includes:
- Strasbaugh 7AA backgrinders
- Disco DFG8540 6 and 8” grinder
- 4 K&S 7500 dicing saws
- Disco DFG6560 Dual Spindle 300mm saw
- Laurier automated pick and place machines
- 3 UV irradiators
- Takatori detaping tools
- KLA Tencor Particle Counter
- TSK polishers
- 2 August NSX Fully Automated Inspection Systems
STM’s technical staff can recommend a semiconductor tape to combat a variety of IC manufacturing challenges including: edge chipping, backside chipping, water seepage, tape residue contamination, difficulty during tape delamination and die removal. STM R&D has experience qualifying semiconductor tapes on wafers up to 12 inches diameter, as thin as 25um, and die as small as 30mil x 30mil, respectively.
Access to STM’s knowledge library provides customers with UV tape technical information regarding PDMS free products, ESD and antistatic tape specifications, tape adhesion testing standards, tape manufacturing process, and product shelf life. This information can be requested by contacting STM directly.
Materials diced with STM tape:
- Silicon
- Ceramic
- Gaas
- Glass
- Quartz
- BGA
- FR4
- PCB
Materials backlapped/backgrinded with STM tape:
- Silicon
- SOI wafers
- Bonded wafers
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