San Jose, California
January 14, 2007

Semiconductor Tapes and Materials, STM, today announced its UV backgrinding Tape, GT-UV-224, is available for semiconductor device manufacturers.

STM’s UV tape, GT-UV-224, is focused on silicon wafers requiring protection from acid etchants but can also be used for standard wafer backside grinding. Although the tape has high adhesion, to protect sensitive front side topography, it exhibits near zero residues after UV irradiation. The properties of GTUV- 224, and competitive price point, lend itself to overcoming common issues associated with tight tolerance wafer thinning. “Our operators are using 224 when grinding wafers that have high ink dots, we have found that its strong adhesion prevents water seepage during grind. At the same time, it offers better uniformity than competitive tapes and is easy to remove after grinding and UV irradiation, “ Hiep Pham, production manager at GDSI.

GT-UV-224 is a polyolefin-based material with acrylic glue. The tape is 110um thick and available in medium to strong tack value. It is manufactured by Denki Kaguku Kogyo Kabushiki Kaisha, DENKA in Gunma, Japan. Tape is labeled STM and distributed by Semiconductor Tapes and Materials Inc.

ABOUT STM
Semiconductor Tapes and Materials provides consumable products for use by integrated circuit manufacturers. STM product line includes uv and non uv backgrinding and dicing tape, dicing blades and diamond grinding wheels. STM is headquartered in San Jose, California.

For More Information Contact:
lhaq@semiconductortapes.com
408 451 2000