San Jose, California
March 4, 2005

Semiconductor Tapes and Materials, STM, today announced the results of a DOE performed to study STM tape’s adhesion value change over time. The study was performed to examine the effect of lag time between mounting parts on tape and subsequent UV cure. In conclusion, consistent nitrogen flow during UV irradiation, minimizing tape to wafer contact time, ensuring extra clean wafer surface and mounting the wafer uniformly to frame, all helped to optimize the pick and place process.

STM’s UV tape, DT-UV-211, was compared in the study to similar competitor tapes. After the DOE was completed, it was observed that optimal results regarding backside die cleanliness could be achieved by ensuring consistent nitrogen flow is present during the uv cure process and limiting the time a wafer is left mounted on tape. A formal white paper on the DOE will be published in subsequent weeks.

ABOUT STM
Semiconductor Tapes and Materials provides consumable products for use by integrated circuit manufacturers. STM product line includes uv and non uv backgrinding and dicing tape, dicing blades and diamond grinding wheels. STM is headquartered in San Jose, California.

For More Information Contact:
lhaq@semiconductortapes.com
408 451 2000