 
Our most common backgrinding tapes are non-UV tapes and
are used to protect wafer surfaces during the backgrinding
process. As the need for thinner, stronger wafers increases,
the need for a high quality tape capable of accommodating these
factors increases also. Our backgrinding tapes are
very successful in standard grinding situations and are
also very effective in thin wafer applications.
Backgrinding Tape Features
- Non Cleaning type created by special adhesive glue and less particles
- Water seepage prevention due to good adhesion to silicon wafer
- Small adhesion strength increase over time
- Low particle count
Factory ISO9001 registered with quality standards JAB accreditation
Factory ISO14001 registered with quality standards JAB accreditation
What's the difference between UV and Non-UV Tape?
Non-UV Backgrinding Tape
| Part # |
Base Film Type |
Color |
Total Thickness
(mm) |
Adhesion Thickness
(mm) |
Adhesive Strength
(N/20mm) |
Characteristics |
Data Sheet |
| GT-117V |
EVA |
LB |
140 |
20 |
1.5 |
Standard grinding tape for Si |
 |
| P-121 |
PET |
LY |
95 |
10 |
17.6 |
Detaper/peeling tape |
|
|
UV Backgrinding Tape
| Part # |
Base Film Type |
Color |
Total Thickness
(mm) |
Adhesion Thickness
(mm) |
Adhesive Strength
(N/20mm) |
Characteristics |
Data Sheet |
| GT-UV-224 |
PO |
MW |
110 |
10 |
2.9 (0.2) |
Standard UV grinding tape for Si |
|
| GT-UV-214A |
PO |
MW |
170 |
20 |
8.4 (0.2) |
Wafers with Surface Features <15um |
|
|
|
