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There are a wide range of physical device characteristics to consider when
selecting a dicing tape, whether it is a UV tape or Non UV tape. These
include substrate, die size, die thickness, frontside/backside
metallization, and sensitive frontside topography. It is because of these characteristics that the
selection process of both UV and non UV semiconductor dicing tape is extremely critical. The technical staff
at STM Inc. has extensive experience in
front-end processing and back-end assembly and packaging
operations. Our dicing tapes have been proven to reduce backside
chipping and allow for ease of die removal.
Many of our dicing tapes are UV
tapes and have a stronger tack
value as a result. UV release tape is an excellent
fit for small-die applications and non-standard
substrate materials such as FR4 board BGA wafers.
Factory ISO9001 registered with quality standards JAB accreditation
Factory ISO14001 registered with quality standards JAB accreditation
What’s the difference between UV Tape and Non-UV Tape?
Non-UV Dicing Tape
| Part # |
Base Film Type |
Color |
Total Thickness ( m m) |
Adhesion Thickness ( m m) |
Adhesive Strength (N/20mm) |
Probe Tack (N/20mm 2 ) |
Chip Size |
Characteristics |
Data Sheet |
| DT-126 |
PVC |
T |
80 |
10 |
1.5 |
0.8 |
All |
Ideal for all size die |
 |
|
UV Dicing Tape
| Part # |
Base Film Type |
Color |
Total Thickness ( mm) |
Adhesion Thickness ( mm) |
Adhesive Strength (N/
20mm) |
Probe Tack (N/
20mm2) |
Expansion |
Chip Size |
Characteristics |
Data Sheet |
DT-
UV-
203 |
PVC |
T |
100 |
10 |
4.5 (0.2) |
2.1 (0.05) |
Excellent |
All |
Si, SiC, GaAs |
|
DT-
UV-
208 |
PO |
MW |
100 |
10 |
2.9 (0.2) |
2.0 (0.05) |
Very
Good |
M,L |
Ideal for Small Die |
|
DT-
UV-
209 |
PO |
MW |
100 |
10 |
7.6 (0.1) |
3.9 (0.05) |
Very
Good |
S,M |
Si dicing, chipping prevention |
|
DT-
UV-
211 |
PO |
MW |
105 |
5 |
5.0 (0.1) |
2.8 (0.05) |
Very
Good |
All |
Si dicing, chipping prevention |
|
DT-
UV-
213 |
PO |
MW |
125 |
25 |
12.0 (0.1) |
5.5 (0.05) |
Very
Good |
S |
Small die, packages |
|
DT-
UV-
214A |
PO |
MW |
170 |
20 |
8.4 (0.2) |
5.6 (0.05) |
Good |
S,M |
For BGA, CSP, or PCB |
|
DT-
UV-
227 |
PET |
T |
125 |
25 |
24.5 (0.05) |
4.9 (0.05) |
Not Good |
All |
Flip-Chip, Testing Die on Tape, Glass or Crystal wafers |
|
| DT- UV- 230 |
PO |
MW |
150 |
25 |
13.5 (0.1) |
5.5 (0.05) |
Good |
S |
Packages |
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