- Higher tack to secure wafer during aggressive grinding process
- Good for non-standard substrates such as FR4 and BGA
- Acid resistant versions available for etch processes
- Effective in securing small die during dicing to prevent die movement and fly-off
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- Exposure to UV light source breaks adhesive bond, thereby facilitating easier tape removal
- Low post cure tackiness reduces wafer breakage during detaping; a benefit in thin wafer applications
- Leaves wafer surface free of impurities, contamination, and other residue.
- Facilitates easy die removal during pick & place operations
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